1. 2. 3. material content data sheet sales product name tle4913 issued 29. august 2013 ma# MA000508952 package pg-sc59-3-4 weight* 13.83 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 0.583 4.22 4.22 42159 42159 leadframe inorganic material silicon 7440-21-3 0.001 0.01 76 non noble metal titanium 7440-32-6 0.005 0.04 379 non noble metal chromium 7440-47-3 0.016 0.11 1138 non noble metal copper 7440-50-8 5.224 37.78 37.94 377819 379412 wire noble metal gold 7440-57-5 0.012 0.09 0.09 858 858 encapsulation organic material carbon black 1333-86-4 0.057 0.41 4137 plastics brominated resin - 0.072 0.52 5171 inorganic material antimonytrioxide 1309-64-4 0.143 1.03 10343 plastics epoxy resin - 1.301 9.41 94118 inorganic material silicondioxide 60676-86-0 5.577 40.33 51.70 403365 517134 leadfinish non noble metal tin 7440-31-5 0.258 1.87 1.87 18667 18667 plating noble metal silver 7440-22-4 0.363 2.63 2.63 26281 26281 glue plastics epoxy resin - 0.037 0.27 2711 noble metal silver 7440-22-4 0.177 1.28 1.55 12778 15489 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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